Skymart Technologies
Back grind tape, thin wafer

SM-TF-BG

Back grind tape, thin wafer

Protective tape with low adhesion and low residue for back grinding thin wafers. Also supplied as a general low residue protective tape and as a high temperature low adhesion tape for handling.

Adhesion
Low
Residue
Low
Width
230 mm to 370 mm
Unit
roll
Minimum order
1 roll

$290.00 per roll, indicative, ex GST

Total $290.00

Also in tapes and films

QFN tape, silicone adhesive

SM-TF-QFN-S

QFN tape, silicone adhesive

Heat resistant polyimide tape that seals the leadframe against mold leakage.

$320.00 per roll, MOQ 2

Die attach film

SM-TF-DAF

Die attach film

Anti-ESD die attach film for stacked die and fingerprint sensor packages.

$48.00 per sheet, MOQ 25

Wafer dicing tape, UV

SM-TF-DIC-UV

Wafer dicing tape, UV

UV release dicing tape for blade and SDBG processes with clean pick up.

$410.00 per roll, MOQ 1