
SM-TF-QFN-S
QFN tape, silicone adhesive
Heat resistant polyimide tape that seals the leadframe against mold leakage.
$320.00 per roll, MOQ 2

SM-TF-DIC-UV
Stable adhesion during blade dicing, then a sharp drop in adhesive strength after UV irradiation. No burr, good die pitch retention, easy pick up and no residue on the wafer. Non-UV grades available for thicker wafers.
$410.00 per roll, indicative, ex GST
Total $410.00

SM-TF-QFN-S
Heat resistant polyimide tape that seals the leadframe against mold leakage.
$320.00 per roll, MOQ 2

SM-TF-DAF
Anti-ESD die attach film for stacked die and fingerprint sensor packages.
$48.00 per sheet, MOQ 25

SM-TF-REL
Wrinkle-free release film for QFN and fan-out compression molding.
$275.00 per roll, MOQ 2