Skymart Technologies
Wafer dicing tape, UV

SM-TF-DIC-UV

Wafer dicing tape, UV

Stable adhesion during blade dicing, then a sharp drop in adhesive strength after UV irradiation. No burr, good die pitch retention, easy pick up and no residue on the wafer. Non-UV grades available for thicker wafers.

Release
UV
Process
Blade, SDBG
Width
230 mm to 370 mm
Roll length
100 m
Unit
roll
Minimum order
1 roll

$410.00 per roll, indicative, ex GST

Total $410.00

Also in tapes and films

QFN tape, silicone adhesive

SM-TF-QFN-S

QFN tape, silicone adhesive

Heat resistant polyimide tape that seals the leadframe against mold leakage.

$320.00 per roll, MOQ 2

Die attach film

SM-TF-DAF

Die attach film

Anti-ESD die attach film for stacked die and fingerprint sensor packages.

$48.00 per sheet, MOQ 25

Mold release film, matte PET

SM-TF-REL

Mold release film, matte PET

Wrinkle-free release film for QFN and fan-out compression molding.

$275.00 per roll, MOQ 2