Skymart Technologies
Die attach film

SM-TF-DAF

Die attach film

Single and double layer polyimide DAF for multi-level stacked packages such as SD, microSD, DDP, QDP and MCP, and for die-to-glass and die-to-ceramic sensor attach. Higher precision at lower cost than epoxy paste. Filler, no-filler, pre-cut and non-pre-cut variants; film over die available.

Grade
Anti-ESD
Layers
Single or double layer PI
Formats
Wafer size pre-cut or roll
Options
Filler, no filler, film over die
Unit
sheet
Minimum order
25 sheets

$48.00 per sheet, indicative, ex GST

Total $1,200.00

Also in tapes and films

QFN tape, silicone adhesive

SM-TF-QFN-S

QFN tape, silicone adhesive

Heat resistant polyimide tape that seals the leadframe against mold leakage.

$320.00 per roll, MOQ 2

Wafer dicing tape, UV

SM-TF-DIC-UV

Wafer dicing tape, UV

UV release dicing tape for blade and SDBG processes with clean pick up.

$410.00 per roll, MOQ 1

Mold release film, matte PET

SM-TF-REL

Mold release film, matte PET

Wrinkle-free release film for QFN and fan-out compression molding.

$275.00 per roll, MOQ 2