
SM-TF-QFN-S
QFN tape, silicone adhesive
Heat resistant polyimide tape that seals the leadframe against mold leakage.
$320.00 per roll, MOQ 2

SM-TF-DAF
Single and double layer polyimide DAF for multi-level stacked packages such as SD, microSD, DDP, QDP and MCP, and for die-to-glass and die-to-ceramic sensor attach. Higher precision at lower cost than epoxy paste. Filler, no-filler, pre-cut and non-pre-cut variants; film over die available.
$48.00 per sheet, indicative, ex GST
Total $1,200.00

SM-TF-QFN-S
Heat resistant polyimide tape that seals the leadframe against mold leakage.
$320.00 per roll, MOQ 2

SM-TF-DIC-UV
UV release dicing tape for blade and SDBG processes with clean pick up.
$410.00 per roll, MOQ 1

SM-TF-REL
Wrinkle-free release film for QFN and fan-out compression molding.
$275.00 per roll, MOQ 2