SM-WR-AU
Gold bonding wire
High purity gold wire for fine pitch thermosonic bonding.
$1,850.00 per spool, MOQ 1
SM-WR-CU
Copper bonding wire
High purity bare copper wire for ball bonding in QFN, SOIC and BGA packages. Palladium coated copper wire available for improved reliability in moisture sensitive applications.
Purity
99.99%
Diameter
18 um to 50 um
Spool
2 inch, 1000 m
Variant
Palladium coated on request
Unit
spool
Minimum order
1 spool
$240.00 per spool, indicative, ex GST
Total $240.00
Also in bonding wire
SM-WR-AG
Silver alloy bonding wire
Silver alloy wire for LED and memory packages.
$620.00 per spool, MOQ 1